Qualcomm Engineer - Packaging Development Lithography R&D, Deutschlandsberg, Austria in Austria
Job Id E1955957
Job Title Engineer - Packaging Development Lithography R&D, Deutschlandsberg, Austria
Post Date 06/20/2017
Company-Division Qualcomm Technologies, Inc.
CDMA Technology at http://www.qualcomm.com/about/businesses/qct
Job Area Engineering - Hardware
Work on lithography R&D, with an emphasis on development and characterization of lithography processes for Wafer Level Packaging of Surface Acoustic Waves (SAW) filters
Design and evaluation of experiments for the definitions of process window and process compatibility
Actively participate in process and technology development and pre-development activities
Design and implement process solutions that meet production and reliability requirements
Responsible for the evaluation and specification of R&D and production machines
Support process and technology transfer to manufacturing
Fluent in English written and verbal
Able to relocate to Deutschlandsberg, Austria
The ideal candidate will have experience in lithography
Should have a basic knowledge of metrology equipment, materials analysis techniques, and surface physics
Knowledge of statistics (DoE and SPC), data analysis and visualization
Have the ability to communicate well with different levels of the organization and build strong, working relationships outside the organization with external partners.
Candidate must be able to integrate into a technical team and assuming the right measures of ownership and accountability in a team environment.
Preferred Qualifications as above
BS degree in engineering, physics, chemistry or in a related discipline with demonstrated ability to perform technical research
Ph.D. degree in Engineering, Chemistry, Physics or other relevant engineering physical science discipline preferredPLEASE SUBMIT CVS AND SUPPORTING DOCUMENTATION IN ENGLISH
EEO employer: including race, gender, gender identity, sexual orientation, disability & veterans status.